NeoGraf Solutions’ next generation of thermal interface materials (TIMs) – HiTherm™ graphite and NeoNxGen™ graphite-based solutions are redefining heat management for data centers and AI hardware by offering unmatched cooling efficiency, stable long-term performance, and maintenance-friendly design. In high-density server and accelerator deployments, graphite TIMs lower chip temperatures and boost energy efficiency by dissipating heat more rapidly than silicone pads or pastes, ensuring even the most power-hungry processors stay cool and reliable. Their solid, compressible sheet form stands up to years of thermal cycling, resisting pump-out, hardening, and dry-out which delivers the consistent, high-performance operation needed for demanding, continuous data center workloads.
Beyond superior thermal conductivity, NeoGraf’s graphite TIMs help cut operational costs and downtime by making system upgrades and repairs simple and clean. Installations are fast, reworkable, and mess-free, allowing data center engineers to maintain uptime while minimizing contamination and labor. This unique combination of high-efficiency cooling, durability, and serviceability makes NeoGraf’s graphite TIMs the obvious upgrade for next generation data center infrastructure.
