HiTherm™ thermal interface materials (TIMs) are engineered to meet the demanding requirements of space and aerospace, where long operational life, repairability, no outgassing, and reliability at temperature extremes are essential for mission success. In environments like low earth orbit, deep space, and advanced aircraft, electronics and power modules often operate under extreme temperature swings, rapid cycling, and vacuum exposure – all conditions where conventional thermal pads may fail due to brittleness, contamination, or delamination.
HiTherm materials’ unique composition maintains stable thermal conductivity and mechanical flexibility from cryogenic lows to high heat loads. It is ideal for use between heat-generating avionic chips, satellite payload electronics, sensor elements, and heat sinks or radiators in the most critical assemblies. The non-silicone, monolithic graphite structure resists outgassing, supporting compliance with strict aerospace material standards while prolonging equipment life and enabling rework or adjustment during integration and maintenance. Whether used in satellite thermal interface stacks, propulsion control units, high-power amplifiers, or spacecraft systems exposed to repeated re-entry cycles, HiTherm thermal interface materials deliver consistent performance and safety, helping engineers overcome the toughest thermal challenges in aerospace design.
